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Products at a Glance

Samsung Electro-Mechanics is engaged in a variety of world-class businesses,
including chip parts, substrates, and camera and communications modules.

Products Information

Passive Component

Applications
Passive Components for the Electronics and IT Industries
  • MLCC(Multilayer Ceramic Capacitors)

    MLCC act as a 'dam' that stores electricity and sends it out by certain amounts, controlling the current to flow consistently in a circuit and preventing electromagnetic interference between components.

    Samsung Electro-Mechanics continues to strive not only to develop IT devices such as smartphones, LED TVs and PCs, but also to develop MLCC for electronics that require higher reliability.

  • Inductor

    Inductors are key components applied to digital devices such as smartphones and help keep the supply voltage of chips and sensors stable.

  • Chip Resistor

    By limiting DC or AC, chip resistors are used to drop the voltage or maintain the current at a certain level inside an electronic circuit.?

  • Tantalum

    Tantalum capacitors are designed as chip-type products to
    ensure they can be surface-mounted. They perform electric
    charging and discharging, and remove noise.

Module

Applications
Camera and Communication Module
  • Camera Module

    Camera modules provide the functionality for taking photos and videos using mobile devices such as smartphones, as well as on automobiles and smart home appliances.

  • Communication Module

    In compliance with IEEE 802.11–based communication standards, the module implements a wireless transmission and reception system for short-range data transmission.

Substrate

Applications
Semiconductors, Modules and IT Devices
  • Package Substrate

    Package substrates, used for the core semiconductors of mobile devices and PCs, are high-density circuit boards containing microcircuits. These substrates transmit electric signals between semiconductors and the main board.

  • RFPCB(Rigid-Flexible Printed Circuit Board)

    An RF PCB consists of a rigid substrate and a flex substrate, and its excellent flexibility eliminates the need for connectors between modules, an advantage for miniaturization and weight lightening. It also possesses a high degree of freedom in design.

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