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RFPCB

Rigid-Flexible Printed Circuit Board

This product consists of rigid and flex components, and the flexibility of the flex component enables 3-D circuit connection. It can withstand 150,000 times of continual flexing, and as there is no need for connectors between modules, this substrate is advantageous in terms of miniaturization. With the high degree of freedom in design, it can maximize space utilization within the set. High-density, thin and various layer structures and designs also are possible.

Application
Smart Phone, Tablet, Note PC, Wearable, Display Module, Camera Module, etc.

Features

1. Miniaturization

It can be folded into various types of 3-D structures and developed into the All Layer Stacked Via formation, which is highly advantageous for miniaturization.

  • [Application Structure of RFPCB for Miniaturization]

  • [All Layer Stacked Via]

2. Space Saving

When a rigid-flex PCB is used, the outer-layer FOB (FPCB on the board) area will not be needed, thereby reducing the substrate size. When the substrate size is reduced, the battery size can be increased and the bezel size can be reduced.

  • T-Con Board Size Down

    • Battery Space Up(Capacity Up)
    • Bezel Width Down(Note PC)

    [Tablet PC]

  • Use Sub Board

    • Battery Space Up(Capacity 16% Up)

    [Smart Phone]

Key Core Technologies

Produces HDI/BGA/FCB products and develops leading technologies as well as generate synergy through the convergence and integration of the technologies of individual products.

  • Can realize HDI-flex products by applying the stack via technology

    • Connection of All Layers 10-12L
    • Line Width/Space : 40/40um
    • 0.4mm Pitch

    [HDI Technology : All Layer]

  • Can realize EPS and EDS rigid-flex products by applying the embedding technology

    • Technology of Putting Active/Passive Components inside a PCB
    • Able to be miniaturized and/or shaped into thin sheets
    • Excellent Electrical Characteristics

    [BGA Technology : Embedded Components]

Lineup

This can be applied to various products, and multiple layers can be combined using the flex and rigid technologies. Mass Production
Line-up by Specification Application, Flex Layer , Rigid Layer Count etc.
Application Flex Layer Count Rigid Layer Count
3Layer 4Layer 6Layer 8Layer 10Layer 12Layer
Camera
Module
Camera Module 2L - 4-2-4 6-2-6 - - -
- 4-2 - - - -
4L - 4-4-4 6-4-6 - - -
Sub/Main
Board
Sub/Main Board 2L - 4-2-4 6-2-6 8-2-8 10-2-10 -
3L - - - - 10-3-10 -
4L - 4-4-4 6-4-6 8-4-8 10-4-10 -
6L - - 6-6-6 8-6-8 10-6-10 -
8L - - - 8-8-8 - -
OLED/LCD
Display
OLED/LCD Display 1L 3-1 4-1 6-1 8-1 10-1 12-1
- - - - 10-1-10-1 -
2L - 4-2-4-1 6-2-6-1 8-2-8-1 - -
4L - - 6-4-6-1 8-4-8-1 - -
6L - - - 8-6-8-1 - -
8L - 4-4-4-1 6-6-6-1 8-8-8-1 - -

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